YOU JUST SCROLLED THROUGH 256 LAYERS.

MEMORY ALREADY FITS THIS MANY LAYERS ON SILICON.

COMPUTE IS ONLY 1 LAYER.
AI NEEDS MORE.

3D CapRAM: COMPUTING INSIDE 3D FLASH

Technology

The DRAM Trap SEMRON Blog
Performance Paper pre-print available now → request access
IEEE CCMCC paper IEEE Xplore
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Board & Advisors

Aron Kirschen

Co-Founder & CEO

Kai-Uwe Demasius

Co-Founder & CTO

Hans Rohrer

Former President TSMC Europe

Hermann Hauser

Founder of ARM

Alex Kalnitsky

Former VP R&D @ TSMC

Pieter Abbeel

Prof. @ UC Berkeley

Boris Murmann

Prof. @ Uni. of Hawaii

Greg Taylor

Mixed-Signal Design Veteran

DRAM IS OVER.

Imprint

Information according to §5 TMG

Company SEMRON GmbH
Address Frauenstr. 9
01067 Dresden
Deutschland / Germany
Represented by Aron Kirschen, Kai-Uwe Demasius
Contact contact (at) semron (dot) net
Register entry HRB 39815
Amtsgericht Dresden
USt-ID DE329034755